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Features:
High thermal conductivity due to use of pure W and pure Cu without sintering additives
Coefficient of thermal expansion matching that of ceramic and semiconductor materials
Excellent hermeticity due to over 99% relative density
High hardness, much more tough than pure copper
Production information
| Type | Composition | Properties | ||||
| Density | CTE, ppm/K | TC, W/m.K | ||||
| element | Content, wt-% | Mass density, g/cc | Relative density, %T.D. | |||
| W90Cu | W Cu | 90±1 balance | 17.0 | ≥99 | 5.6~6.5 | 190~200 |
| W85Cu | W Cu | 85±1 balance | 16.3 | ≥99 | 6.3~7.0 | 200~210 |
| W80Cu | W Cu | 80±1 balance | 15.4 | ≥99 | 7.6~9.1 | 220~230 |
| W50Cu | W Cu | 50±1 balance | 12.3 | ≥99 | 12.3~12.8 | 230~240 |
Features:
High thermal conductivity due to use of pure W and pure Cu without sintering additives
Coefficient of thermal expansion matching that of ceramic and semiconductor materials
Excellent hermeticity due to over 99% relative density
High hardness, much more tough than pure copper
Production information
| Type | Composition | Properties | ||||
| Density | CTE, ppm/K | TC, W/m.K | ||||
| element | Content, wt-% | Mass density, g/cc | Relative density, %T.D. | |||
| W90Cu | W Cu | 90±1 balance | 17.0 | ≥99 | 5.6~6.5 | 190~200 |
| W85Cu | W Cu | 85±1 balance | 16.3 | ≥99 | 6.3~7.0 | 200~210 |
| W80Cu | W Cu | 80±1 balance | 15.4 | ≥99 | 7.6~9.1 | 220~230 |
| W50Cu | W Cu | 50±1 balance | 12.3 | ≥99 | 12.3~12.8 | 230~240 |