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| Quantity: | |
|---|---|
Features:
Large sized sheets available (length up to 400mm, width up to 200mm)
Can be stamped into components
Very strong interface bonding which can repeatedly resist 850 ℃ heat shock
Tailorable CTE matching that of semiconductor and ceramic materials
High thermal conductivity
No magnetism
Production information
| Cu/Mo/Cu | Density g/cm3 | CTE 10-6/K | TC W/m. K x-y Direction | TC W/m. K x-z Direction |
| 1:1:1 | 9.4 | 9.4 | 300~310 | 240~250 |
| 1:2:1 | 9.6 | 7.7 | 260~270 | 210~220 |
| 1:3:1 | 9.7 | 6.9 | 230~240 | 190~200 |
| 1:4:1 | 9.8 | 6.2 | 210~220 | 170~180 |
| 13:74:13 | 9.9 | 5.8 | 190~200 | 160~170 |
Features:
Large sized sheets available (length up to 400mm, width up to 200mm)
Can be stamped into components
Very strong interface bonding which can repeatedly resist 850 ℃ heat shock
Tailorable CTE matching that of semiconductor and ceramic materials
High thermal conductivity
No magnetism
Production information
| Cu/Mo/Cu | Density g/cm3 | CTE 10-6/K | TC W/m. K x-y Direction | TC W/m. K x-z Direction |
| 1:1:1 | 9.4 | 9.4 | 300~310 | 240~250 |
| 1:2:1 | 9.6 | 7.7 | 260~270 | 210~220 |
| 1:3:1 | 9.7 | 6.9 | 230~240 | 190~200 |
| 1:4:1 | 9.8 | 6.2 | 210~220 | 170~180 |
| 13:74:13 | 9.9 | 5.8 | 190~200 | 160~170 |