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Features:
High thermal conductivity due to no sintering additives were used
Excellent hermeticity
Relatively small density
Stampable sheets available(Mo content not more than 75wt.%)
Semi-finished or finished(Ni/Au plated) parts available
Production information
| Type | Composition | Properties | ||||
| Density | CTE, ppm/K | TC, W/m.K | ||||
| element | Content, wt-% | Mass density, g/cc | Relative density, %T.D. | |||
| Mo70Cu30 | Mo Cu | 70±1 balance | 9.7 | ≥99 | 7.6~7.8 | 190~200 |
| Mo60Cu40 | Mo Cu | 60±1 balance | 9.6 | ≥99 | 8.3~8.5 | 200~220 |
| Mo50Cu50 | Mo Cu | 50±1 balance | 9.5 | ≥99 | 9.7~9.9 | 220~250 |
Features:
High thermal conductivity due to no sintering additives were used
Excellent hermeticity
Relatively small density
Stampable sheets available(Mo content not more than 75wt.%)
Semi-finished or finished(Ni/Au plated) parts available
Production information
| Type | Composition | Properties | ||||
| Density | CTE, ppm/K | TC, W/m.K | ||||
| element | Content, wt-% | Mass density, g/cc | Relative density, %T.D. | |||
| Mo70Cu30 | Mo Cu | 70±1 balance | 9.7 | ≥99 | 7.6~7.8 | 190~200 |
| Mo60Cu40 | Mo Cu | 60±1 balance | 9.6 | ≥99 | 8.3~8.5 | 200~220 |
| Mo50Cu50 | Mo Cu | 50±1 balance | 9.5 | ≥99 | 9.7~9.9 | 220~250 |