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Product Introduction
Diamond particle thermal conductivity can reach around 2200 W/(m·K), which is over five times that of pure copper, with a thermal expansion coefficient of less than 1 ppm/K. It is a material characterized by high thermal conductivity and low thermal expansion. The metal matrix diamond composite material, prepared through sintering processes involving metals like copper and diamond particles, possesses both ultra-high thermal conductivity and a low coefficient of thermal expansion. Our diamond-copper and diamond-aluminum materials are characterized by high thermal conductivity, low thermal expansion coefficients, low density, and metallizable surfaces, making them suitable for heat dissipation in high-power electronic device packaging. This effectively reduces chip junction temperatures, enhancing their performance and reliability.
Feature Of Product
1、High thermal conductivity, low coefficient of thermal expansion, and adjustable performance
2、Low density, reducing the weight of the device
3、The surface is capable of metallization treatment and can be plated with nickel and gold
4、Capable of fabricating non-traditional structural components such as convex domes, concave grooves, and other irregular shapes
Performance Table of Metal Fund Corundum Composite Materials
Materials | Type | Thermal W/(m·Kx-y) | RT~200°C CTE ［ppm/K］ | Density ［g/cm3］ |
Diamond-copper | DCu-A | >700 | 6.5±1 | <6 |
DCu-B | >550 | |||
Diamond-Aluminium | DAI-A | >500 | 7±1 | <3.2 |
DAI-B | >400 |
Product Introduction
Diamond particle thermal conductivity can reach around 2200 W/(m·K), which is over five times that of pure copper, with a thermal expansion coefficient of less than 1 ppm/K. It is a material characterized by high thermal conductivity and low thermal expansion. The metal matrix diamond composite material, prepared through sintering processes involving metals like copper and diamond particles, possesses both ultra-high thermal conductivity and a low coefficient of thermal expansion. Our diamond-copper and diamond-aluminum materials are characterized by high thermal conductivity, low thermal expansion coefficients, low density, and metallizable surfaces, making them suitable for heat dissipation in high-power electronic device packaging. This effectively reduces chip junction temperatures, enhancing their performance and reliability.
Feature Of Product
1、High thermal conductivity, low coefficient of thermal expansion, and adjustable performance
2、Low density, reducing the weight of the device
3、The surface is capable of metallization treatment and can be plated with nickel and gold
4、Capable of fabricating non-traditional structural components such as convex domes, concave grooves, and other irregular shapes
Performance Table of Metal Fund Corundum Composite Materials
Materials | Type | Thermal W/(m·Kx-y) | RT~200°C CTE ［ppm/K］ | Density ［g/cm3］ |
Diamond-copper | DCu-A | >700 | 6.5±1 | <6 |
DCu-B | >550 | |||
Diamond-Aluminium | DAI-A | >500 | 7±1 | <3.2 |
DAI-B | >400 |