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Heat Sink Tungsten Copper Alloy

Tungsten copper alloy is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be designed by controlling the content of tungsten, matching that of the materials, such as Ceramics (Al2O3,BeO)、Semiconductors (Si)、Metals (Kovar),etc. The products are widely applicated in the fields such as radio frequency、microwave、high power diode packaging and optical communication system.
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Product Description

Tungsten copper alloy is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be designed by controlling the content of tungsten, matching that of the materials, such as Ceramics (Al2O3,BeO)、Semiconductors (Si)、Metals (Kovar),etc. The products are widely applicated in the fields such as radio frequency、microwave、high power diode packaging and optical communication system.

Product Characteristics

High thermal conductivity due to use of pure W and pure Cu without sintering additives
Coefficient of thermal expansion matching that of ceramic and semiconductor materials
Excellent hermeticity due to over 99% relative density
High hardness, much more tough than pure copper

Data Sheet

Type

Composition

Properties

Density

CTE,
ppm/K10-6/K

TC,W/(m.K)

element

Content,
wt-%

Mass density,
g/cc

Relative density,
%T.D.

W90Cu

WCu

90±2余

17.0±0.3

≥99

5.6~6.5

≥170

W88Cu

WCu

88±2余

16.9±0.3

≥99

5.9~6.7

≥170

W87Cu

WCu

87±2余

16.7±0.3

≥99

6.1~6.8

≥180

W85Cu

WCu

85±2余

16.4±0.3

≥99

6.3~7.0

≥190

W80Cu

WCu

80±2余

15.6±0.3

≥99

7.6~9.1

≥200

W70Cu

WCu

70±2余

14.3±0.3

≥99

9.3~10.2

≥200

W50Cu

WCu

50±2余

12.2±0.3

≥99

12.3~12.8

≥210

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Changsha Saneway Electronic Materials Co., Ltd. is a high-tech enterprise in Hunan Province, specializing in the production of high-performance electronic packaging of W/Cu, Mo/Cu, Cu/Mo/Cu, Cu/Mo70Cu/Cu.

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