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Product Description
Metallic materials such as copper and aluminum have good thermal conductivity, but their coefficient of thermal expansion is high. Thermal stress caused by temperature changes can induce brittle cracks in electronic components, reducing the overall reliability of components. Diamond has excellent comprehensive thermophysical properties, with a thermal conductivity of 700 to 2200W/(m .K) at room temperature and a thermal expansion coefficient of 0.8X10-6/K. According to the mixing rule, diamond/metal matrix composites prepared by adding diamond particles to high thermal conductivity metal substrates such as Ag, Cu, and Al can become a new type of electronic packaging material with low thermal expansion coefficient and high thermal conductivity.
Product Characteristics
1. High thermal conductivity and low coefficient of thermal expansion;
2. Thermal conductivity(CTE) and coefficient of thermal expansion(TC) can be adjusted by controlling the ratio of diamond and copper.
3. The surface can be plated with Ni/Au to achieve airtight packaging.
4. Compared to traditional packaging heat sink materials, it has a low density and can effectively reduce the weight of devices and modules.
Product Description
Metallic materials such as copper and aluminum have good thermal conductivity, but their coefficient of thermal expansion is high. Thermal stress caused by temperature changes can induce brittle cracks in electronic components, reducing the overall reliability of components. Diamond has excellent comprehensive thermophysical properties, with a thermal conductivity of 700 to 2200W/(m .K) at room temperature and a thermal expansion coefficient of 0.8X10-6/K. According to the mixing rule, diamond/metal matrix composites prepared by adding diamond particles to high thermal conductivity metal substrates such as Ag, Cu, and Al can become a new type of electronic packaging material with low thermal expansion coefficient and high thermal conductivity.
Product Characteristics
1. High thermal conductivity and low coefficient of thermal expansion;
2. Thermal conductivity(CTE) and coefficient of thermal expansion(TC) can be adjusted by controlling the ratio of diamond and copper.
3. The surface can be plated with Ni/Au to achieve airtight packaging.
4. Compared to traditional packaging heat sink materials, it has a low density and can effectively reduce the weight of devices and modules.