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Product Description
Cu/Mo/Cu (CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high thermal conductivity and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.
Product Characteristics
Large sized sheets available (length up to 400mm, width up to 200mm)
Can be stamped into components
Very strong interface bonding which can repeatedly resist 850 ℃ heat shock
Tailorable CTE matching that of semiconductor and ceramic materials
High thermal conductivity
No magnetism
Data Sheet
Cu/Mo/Cu | Density | Coefficient of thermal expansion in plane direction ppm/K | Thickness direction thermal conductivity W/m.K |
CMC13:74:13 | 9.9±0.3 | 5.6±0.5 | >160 |
CMC1:1:1 | 9.4±0.3 | 8.8±0.5 | >200 |
CMC1:2:1 | 9.6±0.3 | 7.8±0.5 | >190 |
CMC1:3:1 | 9.7±0.3 | 6.8±0.5 | >180 |
CMC1:4:1 | 9.8±0.3 | 6.0±0.5 | >170 |
Product Description
Cu/Mo/Cu (CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high thermal conductivity and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.
Product Characteristics
Large sized sheets available (length up to 400mm, width up to 200mm)
Can be stamped into components
Very strong interface bonding which can repeatedly resist 850 ℃ heat shock
Tailorable CTE matching that of semiconductor and ceramic materials
High thermal conductivity
No magnetism
Data Sheet
Cu/Mo/Cu | Density | Coefficient of thermal expansion in plane direction ppm/K | Thickness direction thermal conductivity W/m.K |
CMC13:74:13 | 9.9±0.3 | 5.6±0.5 | >160 |
CMC1:1:1 | 9.4±0.3 | 8.8±0.5 | >200 |
CMC1:2:1 | 9.6±0.3 | 7.8±0.5 | >190 |
CMC1:3:1 | 9.7±0.3 | 6.8±0.5 | >180 |
CMC1:4:1 | 9.8±0.3 | 6.0±0.5 | >170 |