Copper diamond material

Metallic materials such as copper and aluminum have good thermal conductivity, but their coefficient of thermal expansion is high. Thermal stress caused by temperature changes can induce brittle cracks in electronic components,reducing the overall reliability of components. Diamond has excellent comprehensive thermophysical properties, with a thermal conductivity of 700 to 2200W/(m .K) at room temperature and a thermal expansion coefficient of 0.8X10-6/K. According to the mixing rule diamond/metal matrix composites prepared by adding diamond particles to high thermal conductivity metal substrates such as Ag, Cu, and Al can become a new type  of electronic packaging material with low thermal expansion coefficient and high  thermal conductivity.