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Our company selects TU1 oxygen free copper and aluminum with a purity of 4N or higher, and uses rolling composite technology to prepare copper aluminum composite strips, which are then stamped into various parts such as leads and gaskets. The aluminum layer composite thickness can be adjusted and is widely used in chip aluminum wire bonding in power devices and lead terminals in IGBT modules.
Our company selects TU1 oxygen free copper and aluminum with a purity of 4N or higher, and uses rolling composite technology to prepare copper aluminum composite strips, which are then stamped into various parts such as leads and gaskets. The aluminum layer composite thickness can be adjusted and is widely used in chip aluminum wire bonding in power devices and lead terminals in IGBT modules.