BTF package base copper tungsten

Product Description

Tungsten copper alloy is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be designed by controlling the content of tungsten, matching that of the materials, such as Ceramics (Al2O3,BeO)、Semiconductors (Si)、Metals (Kovar),etc. The products are widely applicated in the fields such as radio frequency、microwave、high power diode packaging and optical communication system.

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Product Description

Product Characteristics

High thermal conductivity due to use of pure W and pure Cu without sintering additives
Coefficient of thermal expansion matching that of ceramic and semiconductor materials
Excellent hermeticity due to over 99% relative density
High hardness, much more tough than pure copper

Data Sheet

Type	Composition		Properties
	Composition		Density		CTE, ppm/K10-6/K	TC,W/(m.K)
	element	Content, wt-%	Mass density, g/cc	Relative density, %T.D.	CTE, ppm/K10-6/K	TC,W/(m.K)
W90Cu	WCu	90±2余	17.0±0.3	≥99	5.6~6.5	≥170
W88Cu	WCu	88±2余	16.9±0.3	≥99	5.9~6.7	≥170
W87Cu	WCu	87±2余	16.7±0.3	≥99	6.1~6.8	≥180
W85Cu	WCu	85±2余	16.4±0.3	≥99	6.3~7.0	≥190
W80Cu	WCu	80±2余	15.6±0.3	≥99	7.6~9.1	≥200
W70Cu	WCu	70±2余	14.3±0.3	≥99	9.3~10.2	≥200
W50Cu	WCu	50±2余	12.2±0.3	≥99	12.3~12.8	≥210

BTF package base copper tungsten

BTF package base copper tungsten

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